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Volumn 33, Issue 5, 2006, Pages 618-626

Enhancement of air cooling in staggered array of electronic modules by integrating delta winglet vortex generators

Author keywords

Electronic cooling; Heat transfer enhancement; Vortex generator

Indexed keywords

AIR; COOLING; ELECTRIC GENERATORS; REYNOLDS NUMBER; WAKES;

EID: 33646240048     PISSN: 07351933     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.icheatmasstransfer.2006.01.002     Document Type: Article
Times cited : (51)

References (6)
  • 3
    • 0026220733 scopus 로고
    • Enhancement of single phase convective heat transfer from protruding elements using vortex generators
    • Garimella S.V., and Eibeck P.A. Enhancement of single phase convective heat transfer from protruding elements using vortex generators. International Journal of Heat and Mass Transfer 34 9 (1991) 2431-2433
    • (1991) International Journal of Heat and Mass Transfer , vol.34 , Issue.9 , pp. 2431-2433
    • Garimella, S.V.1    Eibeck, P.A.2
  • 4
    • 0345413259 scopus 로고    scopus 로고
    • An experimental assessment of numerical predictive accuracy for electronic component heat transfer in forced convection-Part 1: experimental methods and numerical modeling
    • Rodgers P.J., Eveloy V.C., and Davies M.R.D. An experimental assessment of numerical predictive accuracy for electronic component heat transfer in forced convection-Part 1: experimental methods and numerical modeling. Journal of Electronic Packaging 125 (2003) 67-75
    • (2003) Journal of Electronic Packaging , vol.125 , pp. 67-75
    • Rodgers, P.J.1    Eveloy, V.C.2    Davies, M.R.D.3
  • 5
    • 0012093015 scopus 로고
    • The use of superposition in calculating cooling requirements for circuit board mounted electronic components
    • Arvizu D.E., and Moffat R.J. The use of superposition in calculating cooling requirements for circuit board mounted electronic components. IEEE Paper CH1781-4/48-0133 (1982)
    • (1982) IEEE Paper CH1781-4/48-0133
    • Arvizu, D.E.1    Moffat, R.J.2
  • 6
    • 0030109826 scopus 로고    scopus 로고
    • Comparison of the cooling performance of staggered and in-line arrays of electronic packages
    • Wirtz R.A., and Colban D.M. Comparison of the cooling performance of staggered and in-line arrays of electronic packages. Journal of Electronic Packaging 118 (1996) 27-30
    • (1996) Journal of Electronic Packaging , vol.118 , pp. 27-30
    • Wirtz, R.A.1    Colban, D.M.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.