CERAMIC TAPE - BASED MESO SYSTEMS TECHNOLOGY

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 1998-AE, Issue , 1998, Pages 491-498

  Bau, Haim H ^a   Ananthasuresh, Suresh G K ^a   Santiago Aviles, Jorge J ^a   Zhong, Jihua ^a   Kim, Moon ^a   Yi, Mingqiang ^a   Espinoza Vallejos, Patricio ^a   Sola Laguna, Luis ^b  

^a UNIVERSITY OF PENNSYLVANIA   (United States)

^b DUPONT COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM OXIDE; BINDERS; CERAMIC PRODUCTS; CHEMICAL BONDS; CHIP SCALE PACKAGES; GLASS; GLASS BONDING; LAMINATING; MICROSYSTEMS; PACKAGING MATERIALS; SINTERED ALUMINA; SINTERING; SUBSTRATES; TEMPERATURE;

CERAMIC TAPE TECHNOLOGY; CERAMIC TAPES; DIELECTRIC PASTES; ELECTROMECHANICAL SYSTEMS; LAMINATION PROCESS; LOW TEMPERATURE CO-FIRED CERAMICS; MESO SCALE; ORGANIC BINDERS; PASTE FORMULATIONS; SINTERING PROCESS;

MICROELECTRONICS;

EID: 33646222004     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE1998-1290     Document Type: Conference Paper

References (5)

1. Borland, W., 1989, “Thick Film Hybrids,” Electronic Materials Handbook. Vol. 1, Packaging, ASM International, 332-353.
2. Cawley, J., D., Heuer, A., H., Newman, W., S., & Mathewson, B., B., 1996, “Computer-Aided Manufacturing of Laminated Engineering Materials,” The American Ceramic Society Bulletin Vol. 75, pp. 75-79.
3. Gongora-Rubio, M., Sola-Laguna, L. M., Moffet, P. J., & Santiago-Aviles, J. J., 1998, “The Utilization of Low Temperature Co-Fired Ceramic Technology for Meso-scale EMS, A Simple Thermistor Based Flow Sensor” (in review).
4. Petersen, K., E., 1982, “Silicon as a Mechanical Material,” Proceedings of the IEEE., Vol. 70, 420-457.
5. Poulin, T., Nguyen, L., Larson, G., Michael, M., & Jeeves, N., 1992, “Thermal Conductance of Green Tape Via Arrays,” The ISHM International Symposium on Microelectronics San Francisco, CA., pp 199-206.