The microstructural evolution in large-grained Ni-40Al during superplastic deformation

Journal of Alloys and Compounds

Volumn 415, Issue 1-2, 2006, Pages 177-181

  Jiang, Dongmei ^a   Lin, Dongliang ^b  

^a EAST CHINA NORMAL UNIVERSITY   (China)

^b SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Grain boundaries; High temperature alloys; Intermetallics; Superplasticity

Indexed keywords

DEFORMATION; DIFFRACTION; ELECTRIC NETWORK ANALYSIS; GRAIN BOUNDARIES; INTERMETALLICS; RECRYSTALLIZATION (METALLURGY); SUPERPLASTICITY; TRANSMISSION ELECTRON MICROSCOPY;

ELECTRON BACK-SCATTERED DIFFRACTION (EBSD); HIGH TEMPERATURE ALLOYS; METALLOGRAPHIC EXAMINATION (OM);

MICROSTRUCTURE;

EID: 33646124960     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2005.08.013     Document Type: Article

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