Back-side alignment strategy decouples process from alignment and achieves leading edge overlay performance

Microelectronic Engineering

Volumn 83, Issue 4-9 SPEC. ISS., 2006, Pages 647-650

  Bijnen, F G C ^a   Buel, W V ^a   Young, M ^b   Zhou, X ^b   Gooch, C ^c  

^a ASML   (Netherlands)

^b ASML US Inc   (United States)

^c AGERE SYSTEMS   (United States)

Author keywords

Alignment; Back to back side; Dual side; Front to back side; Overlay; Stacking

Indexed keywords

ALIGNMENT; CHEMICAL MECHANICAL POLISHING; PERFORMANCE; PHOTORESISTS; SILICON WAFERS;

ALIGNMENT STRATEGIES; BACK TO BACK-SIDE ALIGN (BTBA); OVERLAY PERFORMANCE; WAFER ALIGNMENT;

LITHOGRAPHY;

EID: 33646032759     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.01.209     Document Type: Article

References (2)

1. Bijnen F., Buel W.V., Gui C., and Lof J. Proc. SPIE 5037 (2003) 641-646
2. Wittekoek S., and Linders H. Proc. SPIE 538 March (1986) 24-31