Transient creep behavior of a plain woven SiC fiber/SiC matrix composite

JSME International Journal, Series A: Solid Mechanics and Material Engineering

Volumn 48, Issue 4, 2006, Pages 210-214

  Bessho, Takayuki ^c   Ogasawara, Toshio ^b   Aoki, Takuya ^b   Ishikawa, Takashi ^b   Ochi, Yasuo ^a  

^a UNIVERSITY OF ELECTRO COMMUNICATIONS   (Japan)

^b JAPAN AEROSPACE EXPLORATION AGENCY   (Japan)

^c NONE

Author keywords

Ceramic matrix composite; Creep deformation; Nonlinear stress strain behavior

Indexed keywords

CERAMIC MATRIX COMPOSITES; CORRELATION METHODS; CREEP; CREEP TESTING; HARDENING; MATHEMATICAL MODELS; STRAIN RATE; TENSILE STRESS; TENSILE TESTING;

CREEP DEFORMATION; NONLINEAR STRESS-STRAIN BEHAVIOR; PLAIN WOVEN; TENSILE CREEP TESTS; TRANSIENT CREEP BEHAVIOR;

SILICON CARBIDE;

CERAMIC MATRIX COMPOSITES; CORRELATION METHODS; CREEP; CREEP TESTING; HARDENING; MATHEMATICAL MODELS; SILICON CARBIDE; STRAIN RATE; TENSILE STRESS; TENSILE TESTING;

EID: 33645984558     PISSN: 13447912     EISSN: 13475363     Source Type: Journal    
DOI: 10.1299/jsmea.48.210     Document Type: Article

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