Evaluation of 2 thione primers and 3 resin adhesives for silver-palladium-copper-gold alloy bonding

Quintessence International

Volumn 37, Issue 5, 2006, Pages 395-399

  Koishi, Yoshikazu ^a   Tanoue, Naomi ^a,d   Yanagida, Hiroaki ^a   Atsuta, Mitsuru ^b   Nakamura, Mitsuo ^c   Matsumura, Hideo ^d  

^a NAGASAKI UNIVERSITY HOSPITAL   (Japan)

^b NAGASAKI UNIVERSITY GRADUATE SCHOOL OF BIOMEDICAL SCIENCES   (Japan)

^c Nihon University School of Dentistry ^*

^d NAGASAKI UNIVERSITY   (Japan)

Author keywords

Initiator system; Resin adhesive; Shear bond strength; Silver palladium copper gold alloy; Thermocycling; Thione primer

Indexed keywords

ALUMINUM OXIDE; BORON DERIVATIVE; COPPER; DRUG DERIVATIVE; GOLD ALLOY; METALTITE; METHACRYLIC ACID DERIVATIVE; METHACRYLIC ACID METHYL ESTER; MULTIBOND; PALLADIUM; RESIN CEMENT; SILVER; SUPER BOND; SUPER-BOND; THIOURACIL; TOOTH CEMENT; TRIAZINE DERIVATIVE; V PRIMER; V-PRIMER;

ARTICLE; CHEMISTRY; DENTAL BONDING; DENTAL CARE; DENTAL SURGERY; HUMAN; INSTRUMENTATION; MATERIALS TESTING; MECHANICAL STRESS; SHEAR STRENGTH;

AIR ABRASION, DENTAL; ALUMINUM OXIDE; BORON COMPOUNDS; COPPER; DENTAL BONDING; DENTAL CEMENTS; DENTAL STRESS ANALYSIS; GOLD ALLOYS; HUMANS; MATERIALS TESTING; METHACRYLATES; METHYLMETHACRYLATES; PALLADIUM; RESIN CEMENTS; SHEAR STRENGTH; SILVER; STRESS, MECHANICAL; THIOURACIL; TRIAZINES;

EID: 33645938308     PISSN: 00336572     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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