Enhanced boiling heat transfer of FC-72 from surfaces with microstructures

Kung Cheng Je Wu Li Hsueh Pao/Journal of Engineering Thermophysics

Volumn 27, Issue 2, 2006, Pages 247-250

  Wei, Jin Jia ^a   Honda, Hiroshi ^b  

^a XI'AN JIAOTONG UNIVERSITY   (China)

^b KYUSHU UNIVERSITY   (Japan)

Author keywords

Cooling; Electronic component; Enhanced boiling heat transfer; Microstructure

Indexed keywords

EID: 33645919320     PISSN: 0253231X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)