Smart tooling for assembly of thin flexible systems

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 268-274

  Chen, Ruijun ^a   Baldwin, D F ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; CHIP SCALE PACKAGES; COMPUTER AIDED DESIGN; ELECTRIC NETWORK ANALYSIS; EQUIPMENT; FLEXIBLE ELECTRONICS; INTERFACES (MATERIALS); PACKAGING; PACKAGING MATERIALS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SOLDERING; SURFACE MOUNT TECHNOLOGY;

ASSEMBLY EQUIPMENT; CLOSED FORM SOLUTIONS; ELECTRONIC ASSEMBLIES; FLEXIBLE CIRCUIT BOARDS; PERPENDICULAR ASSEMBLIES; SOLDER PASTE PRINTING; THERMO-MECHANICAL; TRANSVERSE DISPLACEMENTS;

SUBSTRATES;

EID: 33645914578     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757325     Document Type: Conference Paper

References (8)

1. Kim Sterling, 1996, "The Future Is Bright for Flex," http://www.ipc.org/html/flexart.htm
2. Harvey Miller, 1996, "Changing Market Dynamics of Flex," Flexible Circuits Engineering, January/February, 1996, http://www.flexlinx.com/~flexcomm/janfeb1996/MktDynmcs.html.
3. Ray Jasinski, 1996, "The Future for Flex," Flexible Circuits Engineering, September/October, 1996, http://\vww.flexlinx.com/~flexcomin/sepoctl996/flxfutr.html
4. Larry Aderman and David Brink, 1991, "Fixturing-The Forgotten Element," Surface Mount Technology, February, pp. 62-63.
5. Mark Curtin, "Fixture Furnish PC Card Stability," Surface Mount Technology, 1995, August, pp.113117.
6. Mark Curtin, "Tooling 'Nests' Support Print-Bound PCBs," Surface Mount Technology, 1995, February, pp. 120-123.
7. E. Reissner, "On the Theory of Bending of Elastic Plates," Journal of Mathematics and Physics, Vol. 23, Feb. 1944, pp. 184-191.
8. Rudolph Szilard, "Theory and Analysis of Plates: Classical and Numerical Methods," Prentice-Hall. Inc., 1974, Chapter 1, pp. 1-151.