Device for in situ cleaving of hard crystals

Review of Scientific Instruments

Volumn 77, Issue 3, 2006, Pages

  Schmid, M ^a   Renner, A ^a   Giessibl, F J ^a  

^a UNIVERSITY OF AUGSBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CRYSTALS; NICKEL COMPOUNDS; OPTICAL MICROSCOPY; SURFACE PHENOMENA; ULTRAHIGH VACUUM; VACUUM APPLICATIONS;

CLEAVING CRYSTALS; CLEAVING PLANE; CUTTING PLIERS; VACUUM CHAMBER;

MATERIALS SCIENCE;

EID: 33645835961     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2166670     Document Type: Article

References (12)

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4. B. Dupoisson, P. Dumas, A. Steinbrunn, and J. C. Colson, J. Phys. E 9, 266 (1976).
5. R. Carr, Rev. Sci. Instrum. 59, 989 (1988).
6. J. T. Yates, Experimental Innovations in Surface Science (Springer, Berlin, 1998).
7. F. J. Giessibl, Ph.D. thesis, Ludwig-Maximilians-Universität München, Germany, 1991.
8. M. Otha, Y. Sugawara, S. Morita, N. Nagaoka, S. Mishima, and T. Okada, J. Vac. Sci. Technol. B 12, 1705 (1994).
9. Y. -C. Kim, M. J. Nopwakowski, and D. N. Seidmann, Rev. Sci. Instrum. 67, 1992 (1996).
10. M. Reichling (private communication).
11. M. E. Eberhart, Why Things Break (Harmony Books, New York, 2003).
12. See EPAPS Document No. E-RSINAK-77-209602 for the movies illustrating the cleavage process. This document can be reached through a direct link in the online article's HTML reference section or via the EPAPS homepage (http://www.aip.org/pubservs/epaps.html).