Processing robustness for a phenylethynyl-terminated polyimide composite

Journal of Applied Polymer Science

Volumn 100, Issue 4, 2006, Pages 3212-3221

  Hou, T H ^a  

^a NASA LANGLEY RESEARCH CENTER   (United States)

Author keywords

Composites; Curing of polymers; Polyimides; Voids

Indexed keywords

CURING OF POLYMERS; OPEN HOLE COMPRESSION (OHC); PROCESSING ROBUSTNESS; ROOM-TEMPERATURE; VOIDS;

KETONES; OLIGOMERS; OPTIMIZATION; ORGANIC COMPOUNDS; POLYIMIDES; TEMPERATURE MEASUREMENT;

COMPOSITE MATERIALS;

COATING; COMPOSITE; LAMINATE; MORPHOLOGY; OLIGOMER; POLYAMINE; PREPREG; RHEOLOGY;

EID: 33645772979     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.21625     Document Type: Article

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