Preparation of nano-particle copper by chemical reduction

Acta Chimica Sinica

Volumn 62, Issue 23, 2004, Pages 2365-2368

  Lin, Rong Hui ^a,b   Fang, Liang ^a   Xi, Ying Xin ^a   Shao, Yan Xia ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

^b QINGDAO TECHNOLOGICAL UNIVERSITY   (China)

Author keywords

Nano particle copper; Protective agent; Reaction course; Reduction

Indexed keywords

EID: 33645736828     PISSN: 05677351     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (14)

1. Yi, Y.-H. Prog. Chem. Ind. Eng. 2001, (9), 13 (in Chinese).
2. Zhang, Y.-H. Chin. J. Rare Metals 1997, 21(6), 451 (in Chinese).
3. Heino, P.; Ristolainen, E. Nanostruct. Mater. 1999, (5), 587.
4. Sanders, P. G.; Truncone, S. A.; Scott, W. Acta Mater. 1997, (10), 4019.
5. Wu, Z.-G. J. Funct. Polym. 2001, 14(4), 449 (in Chinese).
6. Zhao, A.-C. Polym. Bull. 2001, (1), 74 (in Chinese).
7. Wang, L.-J.; Guo, C.-W. Acta Chim. Sinica 2002, 60, 1125 (in Chinese).
8. Yan, G.-H. Mater. Rev. 1997, (11), 16 (in Chinese).
9. Chen, Z.-Y. Acta Metallurgica Sinica 1992, 28, 169 (in Chinese).
10. Huang, J.-S.; Ren, S.; Liu, Y.-X. J. Guangdong Univ. Technol. 2003, 20, 6 (in Chinese).
11. Chen, Q.-C.; Yang, H.-F. Phys. Test. Chem. Anal. P. B.: Chem. Anal. 1997, 33, 179 (in Chinese).
12. Li, Z.-W.; Zhu, Y.-F. Acta Chim. Sinica 2003, 61, 1484 (in Chinese).
13. Liao, R.; Zhou, D.-L.; Zhang, W.-Z. Sichuan Nonferrous Metals 2003, (2), 28 (in Chinese).
14. Jiang, X.-X.; Shen, W. In The Fundamentals and Practice of Electroless Plating, Ed.: Zhou, R. F., National Defence Industry Press, Bejing, 2000, p. 21 (in Chinese).