Effect of surface passivation removal on planarization efficiency in Cu abrasive-free polishing

Journal of the Electrochemical Society

Volumn 153, Issue 1, 2006, Pages

  Fang, J Y ^a,c   Tsai, M S ^b   Dai, B T ^b   Wu, Y S ^a,c   Feng, M S ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

^c ELECTROCHEMICAL SOCIETY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVE-FREE POLISHING; CU AFP; PLANARIZATION EFFICIENCY; SURFACE PASSIVATION;

ABRASION; COPPER; ELECTROCHEMISTRY; MONOLAYERS; PASSIVATION; POLISHING;

SURFACE PHENOMENA;

EID: 33645514814     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2128100     Document Type: Article

References (6)

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