Wafer scale packaging of MEMS by using plasma-activated wafer bonding

Journal of the Electrochemical Society

Volumn 153, Issue 1, 2006, Pages

  Suni, T ^a,b   Henttinen, K ^a,b   Lipsanen, A ^a   Dekker, J ^a   Luoto, H ^a,b   Kulawski, M ^a  

^a VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

^b ELECTROCHEMICAL SOCIETY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL CONTACTS; INTERMEDIATE BONDING LAYER; WAFER LEVEL; WAFER SCALE PACKAGING;

BONDING; CHEMICAL VAPOR DEPOSITION; ENCAPSULATION; LITHOGRAPHY; PLASMA APPLICATIONS; POLYSILICON; RESONATORS; SAWING; SPUTTERING; WSI CIRCUITS;

MICROELECTROMECHANICAL DEVICES;

EID: 33645511623     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2135209     Document Type: Article

References (6)

1. F. Geefay, U.S. Pat. 6,836,013 (2004).
2. G. Fountain, Q.-Y. Tong, P. Enquist, and R. Markunas, U.S. Pat. 6,822,326 (2004).
3. T. Suni, K. Henttinen, I. Suni, and J. Mäkinen, J. Electrochem. Soc., 149, G348 (2002).
4. Q.-Y. Tong and U. Gösele, Semiconductor Wafer Bonding, p. 25, John Wiley & Sons, New York (1999).
5. D. C. Hermes, T. Heuser, E. J. van der Wouden, J. G. E. Gardeniers, and A. van den Berg, Workshop on Wafer Bonding for MEMS Technologies, Book of Abstracts, pp. 37-38, Halle, Germany (2004).
6. C. Jia and M. Wiemer, Presentation at Workshop on Wafer Bonding for MEMS Technologies, Oct 11, 2005, Halle, Germany.