Carbon nanotube thermal transport: Ballistic to diffusive

Applied Physics Letters

Volumn 88, Issue 11, 2006, Pages

  Wang, Jian ^a   Wang, Jian Sheng ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; INTERFACES (MATERIALS); THERMAL CONDUCTIVITY; THERMAL EFFECTS; VIBRATIONS (MECHANICAL);

DIFFUSIVE REGIMES; THERMAL CONDUCTANCE; UMKLAPP PROCESS;

CARBON NANOTUBES;

EID: 33645164966     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2185727     Document Type: Article

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