Thermal diffusivity of lead-free solders measured by photothermal beam deflection. Effect of the surrounding media

Journal De Physique. IV : JP

Volumn 125, Issue , 2005, Pages 265-268

  Prior, P ^a   Goren A ^a   Macedo, F ^a   Ferreira, J A ^a   Soares, D ^a  

^a UNIVERSITY OF MINHO   (Portugal)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; ELECTRONICS INDUSTRY; MICROELECTRONICS; SOLDERING; THERMAL DIFFUSION;

MICROELECTRONIC ASSEMBLIES; PHOTOTHERMAL BEAM DEFLECTION; THERMAL DIFFUSIVITIES;

SOLDERING ALLOYS;

EID: 33645074724     PISSN: 11554339     EISSN: 17647177     Source Type: Conference Proceeding    
DOI: 10.1051/jp4:2005125063     Document Type: Conference Paper

References (5)

1. A. C. Boccara, D. Fournier, J. Badoz, Appl. Phys. Lett., 37, 130 (1980).
2. A. Yarai, Y. Yamaura, T. Nakanishi, Jpn J. Appl. Phys., 41, 3325 (2002).
3. Nibu A. George, C. P. G. Vallabhan, V. P. N. Nampoori, P. Radhakrishnan, Appl. Opt., 41, (24), 5179 (2002).
4. P. Prior, F. Macedo, F. Cerqueira, J. A. Ferreira, D. Soares, submitted for publication in Microelectronics J.
5. S. E. Bialkowsy, Photothermal Spectroscopy Methods For Chemical Analysis, John Wiley & Sons, New York (1996), Vol. 134 in Chemical Analysis.