Integrated reliability solutions for new component development and designs optimization

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 5, Issue , 2005, Pages 131-137

  Wu, Xiaohua ^a   Qian, Zhengfang ^a   Wang, Yinyan ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PAD STACK DESIGNS; PROTOTYPE DEVELOPMENT; SOLDERABILITY; THERMAL FATIGUE;

COMPUTER SIMULATION; ENGINES; FATIGUE OF MATERIALS; OPTIMIZATION; PRODUCT DEVELOPMENT;

MACHINE DESIGN;

EID: 33645071339     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2005-82320     Document Type: Conference Paper

References (7)

1. Wassink, RJ. Klein, "Soldering in Electronics". Electrochemical Publications Limited, Scotland, 1989.
2. Wu, X., "Solderability Analysis for SMT Leadless Component", Motorola PRRC technology report, 2003.
3. Wu, X, J. Tomase and M. Kas, "Simulation for 0201 Leadless Component Reflow Design and Defect Analysis", Motorola 2002 SMS.
4. Brakke, K. A., 1995: Surface Evolver Manual, version 1.99. The Geometry Center, 1300 S. Second St., Minneapolis, MN 55454.
5. Wang, Y., X. Wu, Z. Qian, G. Song, and J. Tomase, "Development of a Software Tool - Integrated Reliability Solutions", Motorola 2003 SMS.
6. Qian, Z., Personal discussion.
7. th Quarter, 1999.