Thermal reliability design and optimization for multilayer composite electronic boards

American Society of Mechanical Engineers, Design Engineering Division (Publication) DE

Volumn 118 B, Issue 2, 2005, Pages 845-851

  Khalilollahi, Amir ^a   Qnipede, Oladipo ^a   Warley, Russell L ^a  

^a BEHREND COLLEGE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MATERIALS; FAILURE (MECHANICAL); HEAT TRANSFER; MULTILAYERS; OPTIMIZATION; TEMPERATURE DISTRIBUTION;

HEAT GENERATION; METAMODEL; PARALLEL CIRCUIT BOARDS; STRESS INTENSITY;

PRINTED CIRCUIT BOARDS;

EID: 33645036280     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2005-82560     Document Type: Conference Paper

References (12)

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