Electroless deposition of Co-based alloys for selective capping applications

Advanced Metallization Conference (AMC)

Volumn , Issue , 2006, Pages 577-586

  Michaelson, L M ^a   Mathew, V ^a   Gall, M ^a   Hauschildt, M ^a   Acosta, E ^a   Garcia, S ^a   Jiang, Z X ^a   Kim, K ^a   Fejes, P ^a  

^a FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BATH REPLENISHMENT; COWBP FILMS; PLATING BATHS; SELECTIVE CAPPING APPLICATIONS; CAPPING APPLICATIONS; COWB ELECTROLESS PROCESS; REDUCING AGENTS; RESISTOR STRUCTURES;

CAPACITANCE; COBALT ALLOYS; DEPOSITION; PHOSPHORESCENCE; PLATING; THIN FILMS; CLEANING; DIFFUSION; PHOSPHORUS; RESISTORS;

ELECTROLESS PLATING;

EID: 33644944849     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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