SCOPUS 정보 검색 플랫폼

Materials Science and Engineering: A

Volumn 419, Issue 1-2, 2006, Pages 8-11

Aging properties studies in a Cu-Ag-Cr Alloy

(7) Jia, Shu Guo a Zheng, M S a Liu, P b Ren, F Z b Tian, B H b Zhou, G S a Lou, H F c

a XI'AN JIAOTONG UNIVERSITY (China)

b HENAN UNIVERSITY OF SCIENCE AND TECHNOLOGY (China)

c CHINALCO Luoyang Copper Co Ltd (China)

Author keywords

Aging; Copper alloy; Hardening; Precipitate

Indexed keywords

AGE HARDENING; ELECTRIC CONDUCTIVITY; METAL MELTING; METALLOGRAPHIC MICROSTRUCTURE; MICROHARDNESS; PRECIPITATION (CHEMICAL); TRANSMISSION ELECTRON MICROSCOPY;

PRECIPITATES; VACUUM INDUCTION MELTING;

COPPER ALLOYS;

AGE HARDENING; COPPER ALLOYS; ELECTRIC CONDUCTIVITY; METAL MELTING; METALLOGRAPHIC MICROSTRUCTURE; MICROHARDNESS; PRECIPITATION (CHEMICAL); TRANSMISSION ELECTRON MICROSCOPY;

EID: 33644913399 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2005.09.118 Document Type: Article

Times cited : (59)

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