Lifetime of solid metals in contact with liquid solders for high-temperature liquid solder assemblies

Scripta Materialia

Volumn 54, Issue 10, 2006, Pages 1773-1778

  Li, J F ^a   Mannan, S H ^a   Clode, M P ^a  

^a KING'S COLLEGE LONDON   (United Kingdom)

Author keywords

Interface dynamics; Intermetallic compounds; Kinetics; Liquid; Modelling

Indexed keywords

COMPUTER SIMULATION; CONTACTS (FLUID MECHANICS); DISSOLUTION; INTERMETALLICS; LIQUIDS; METALLIZING; SOLDERING ALLOYS; SPECIFIC HEAT;

INTERFACE DYNAMICS; KINETICS; LATENT HEAT OF FUSION; MELTING POINTS;

METAL ANALYSIS;

EID: 33644910217     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2006.01.037     Document Type: Article

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