Aspects of scaling CVD diamond reactors

Diamond and Related Materials

Volumn 15, Issue 2-3, 2006, Pages 229-233

  Zimmer, Jerry ^a   Ravi, K V ^b  

^a Sp3 Inc   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

300 mm wafers; Hot filament; Scaling; Stress; Temperature uniformity; Uniformity

Indexed keywords

CHEMICAL VAPOR DEPOSITION; DIAMOND CUTTING TOOLS; DIAMOND FILMS; THERMOCOUPLES;

300 MM WAFERS; HOT FILAMENT; SCALING; TEMPERATURE UNIFORMITY; UNIFORMITY;

CHEMICAL REACTORS;

EID: 33644879453     PISSN: 09259635     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.diamond.2005.08.042     Document Type: Article

References (5)

1. R. Haubner, and B. Lox Diamond and Related Materials 2 1993 1277
2. K.V. Ravi, and M.I. Landstross Proceedings of the First International Symposium on Diamond and Diamond like Films The Electrochemical Society vol. 89-12 1989 24
3. Brief definitions of Bow and Warp are as follows: Concavity, curvature, or deformation of the wafer centerline, independent of any thickness variation present. Deviation from a plane of a slice or wafer centerline containing both concave and convex regions.
4. H. Windishman, and Glenn F. Epps Journal of Applied Physics 69 1991 2231
5. L. Schaefer, S. Arndt, D. Herrmann, M. Hoefer, M. Fryda, and T. Matthee Electrochemical water treatment with diamond electrodes 9th International Conference on New Diamond Science and Technology vol. 90 2004 Abstract book