Effect of elastic recovery on the electrical contact resistance in anisotropic conductive adhesive assemblies

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 1, 2006, Pages 137-144

  Chin, Melida ^a   Barber, James R ^a   Hu, S Jack ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Adhesive strength; Anisotropic conductive adhesives; Bonding force; Contact area; Delamination; Elastic recovery; Electrical contact resistance; Residual stress

Indexed keywords

ADHESIVES; ALGORITHMS; ANISOTROPY; BONDING; DELAMINATION; ELASTIC MODULI; ELASTICITY; ELECTRIC RESISTANCE; FRACTURE MECHANICS; ITERATIVE METHODS; RESIDUAL STRESSES; STRENGTH OF MATERIALS;

ADHESIVE STRENGTH; ANISOTROPIC CONDUCTIVE ADHESIVE (ACA); BONDING FORCE; CONTACT AREA; ELASTIC RECOVERY; ELECTRICAL CONTACT RESISTANCE;

CONDUCTIVE MATERIALS;

EID: 33644792235     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.853166     Document Type: Article

References (16)

1. J. Liu, Conductive Adhesives for Electronics Packaging. London, U.K.: Electrochemical Publ., Ltd., 1999.
2. M. Chin, K. Iyer, and S. J. Hu, "Prediction of electrical contact resistance for anisotropic conductive adhesive assemblies," IEEE Trans. Compon. Packag. Technol., vol. 27, no. 2, pp. 317-326, Jun. 2004.
3. D. J. William, D. C. Whalley, O. A. Boyle, and A. O. Ogunjimi, "Anisotropic conductive adhesives for electronic interconnection," Solder Surf. Mount Technol., no. 14, pp. 4-8, 1993.
4. K. X. Hu, C. P. Yeh, and K. W. Wyatt, "Electro-thermo-mechanical responses of conductive adhesive materials," IEEE Trans. Compon., Packag., Manufact. Technol. A, vol. 20, no. 4, pp. 470-477, Dec. 1997.
5. M. J. Yim and K. W. Paik, "Design and understanding of anisotropic conductive adhesive (ACFs) for LCD packaging," IEEE Trans. Compon., Packag., Manufact. Technol. A, vol. 21, no. 2, pp. 226-234, Jun. 1998.
6. F. G. Shi, M. Abdullah, S. Chungpaiboonpatana, K. Okuyama, C. Davidson, and J. M. Adam, "Electrical conduction of anisotropic conductive adhesives: Effect of size distribution of conducting filler particles," Mater. Sci. Semicond. Process, vol. 2, pp. 263-269, 1999.
7. C. N. Oguibe, S. H. Mannan, D. C. Whalley, and D. J. Williams, "Conduction mechanisms in anisotropic conducting adhesive assembly," IEEE Trans. Compon., Packag., Manufact. Technol. A, vol. 21, no. 2, pp. 235-242, Jun. 1998.
8. Y. Fu, M. Willander, and J. Liu, "Statistics of electric conductance through anisotropically conductive adhesive," IEEE Trans. Compon. Packag. Technol., vol. 24, no. 2, pp. 250-255, Jun. 2001.
9. M. J. Yim and K. W. Paik, "Effect of nonconducting filler additions on ACA propereties and the reliability of ACA flip chip on organic substrates," IEEE Trans. Compon. Packag. Technol., vol. 24, no. 1, pp. 171-176, Mar. 2001.
10. K. N. Chiang, C. W. Chang, and C. T. Lin, "Process modeling and thermal/mechanical behavior of ACA/ACF type flip-chip packages," ASME J Electron. Packag., vol. 123, pp. 331-337, Dec. 2001.
11. Y. N. Cheng, S. Lee, and J. Lee, "Finite element analysis of anisotropic conductive film for chip on glass progress," Mater. Manufact. Process, vol. 17, pp. 765-781, Dec. 2002.
12. "Determination of compressive properties," Tech. Rep. DIN EN ISO 604 Plastics, 1993.
13. A. J. Kinloch, C. C. Lau, and J. G. Williams, "The peeling of flexible laminates," Int. J. Fracture, vol. 66, pp. 45-70, 1994.
14. D. R. Moore, A. Pavan, and J. G. Williams, Fracture Mechanics Testing Methods for Polymers, Adhesives, and Composites. Amsterdam, The Netherlands: Elsevier, 2001.
15. M. Chin, "Electrical contact resistance of anisotropic conductive adhesive assemblies in microelectronics packaging," Ph.D. dissertaion, Dept. Mech. Eng., Univ. Michigan, Ann Arbor, 2005.
16. K. L. Mittal, Adhesion Measurement of Films and Coatings. Amsterdam, The Netherlands: VSP, 2001, vol. 2.