Adhesion and reinforcement in carbon nanotube polymer composite

Applied Physics Letters

Volumn 88, Issue 9, 2006, Pages

  Wei, Chenyu ^a  

^a NASA AMES RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON NANOTUBE POLYMER COMPOSITE; HALPIN-TSAI FORMULA; INTERFACIAL SHEAR STRESS; NONCOVALENT BONDS;

ADHESION; ELASTIC MODULI; MOLECULAR DYNAMICS; POLYMER BLENDS; REINFORCEMENT; TENSILE STRENGTH; VAN DER WAALS FORCES;

CARBON NANOTUBES;

EID: 33644700371     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2181188     Document Type: Article

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