Damage evolution under bending and tensile stress and its influence on critical current of Bi2223/Ag superconducting composite tape

Journal of Nuclear Materials

Volumn 329-333, Issue 1-3 PART B, 2004, Pages 1585-1589

  Ochiai, S ^a   Miyazaki, N ^a   Doko, D ^a   Nagai, T ^a   Nakamura, M ^a   Okuda, H ^a   Oh, S S ^b   Hojo, M ^a   Tanaka, M ^a   Osamura, K ^a  

^a KYOTO UNIVERSITY   (Japan)

^b Korea Electrotechnology Research Institute (KERI)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); COMPRESSIVE STRENGTH; COOLING; CRITICAL CURRENTS; FRACTURE; HEAT TREATMENT; MAGNETIC FIELDS; MATHEMATICAL MODELS; SUPERCONDUCTING TAPES; TENSILE STRESS;

BENDING STRAIN; RESIDUAL STRAINS; ROOM TEMPERATURE; SUPERCONDUCTING COMPOSITE TAPES;

BISMUTH COMPOUNDS;

EID: 3342994373     PISSN: 00223115     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jnucmat.2004.04.165     Document Type: Conference Paper

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