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Volumn 13, Issue 7, 2004, Pages 37-40
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Design for reliability of stacked die CSPs
a
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Author keywords
[No Author keywords available]
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Indexed keywords
DUMMY BALLS;
FATIGUE MODELING;
SOLDER PAD OPENING SIZE;
STACKED DIES;
COMPUTER SIMULATION;
COST ACCOUNTING;
DESIGN;
DIES;
FATIGUE OF MATERIALS;
FLIP CHIP DEVICES;
MICROELECTROMECHANICAL DEVICES;
PACKAGING;
RELIABILITY;
SOLDERED JOINTS;
THERMAL CYCLING;
CHIP SCALE PACKAGES;
CHIPS;
DIES;
FATIGUE;
PACKAGING;
SOLDERING;
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EID: 3342915761
PISSN: 10650555
EISSN: None
Source Type: Trade Journal
DOI: None Document Type: Review |
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Times cited : (5)
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References (0)
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