High-pitch metal-on-glass technology for pad pitch adaptation between detectors and readout electronics

IEEE Transactions on Nuclear Science

Volumn 51, Issue 3 III, 2004, Pages 968-974

  Ullán, Miguel ^a   Lozano, Manuel ^a   Campabadal, Francesca ^a   Fleta, Celeste ^a   García, Carmen ^b   González, Francisco ^b   Bernabeu, José ^b  

^a INSTITUTO DE MICROELECTRÓNICA DE BARCELONA   (Spain)

^b UNIVERSITY OF VALENCIA   (Spain)

Author keywords

Hybrid integrated circuit bonding; Hybrid integrated circuit interconnections; Integrated circuit bonding; Integrated circuit metallization; Interconnections; Microstrip; Radiation detectors; Thin film circuit fabrication

Indexed keywords

CHANNEL CAPACITY; GAS DETECTORS; HARDNESS; INTEGRATED CIRCUITS; PASSIVATION; RADIATION DETECTORS; READOUT SYSTEMS; THIN FILMS;

HYBRID INTEGRATED CIRCUIT BONDING; HYBRID INTEGRATED CIRCUIT INTERCONNECTIONS; INTEGRATED CIRCUIT BONDING; INTEGRATED CIRCUIT METALLIZATION; INTERCONNECTIONS; MICROSTRIP; THIN FILM CIRCUIT FABRICATION;

GLASS;

EID: 3342888988     PISSN: 00189499     EISSN: None     Source Type: Journal    
DOI: 10.1109/TNS.2004.829365     Document Type: Conference Paper

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