Adsorption of copper and lead species at electrochemically activated glassy carbon electrodes

Electrochimica Acta

Volumn 51, Issue 13, 2006, Pages 2631-2638

  Shi, Kang ^a   Shiu, Kwok Keung ^b  

^a XIAMEN UNIVERSITY   (China)

^b HONG KONG BAPTIST UNIVERSITY   (Hong Kong)

Author keywords

Adsorption; Copper and lead species; Electrochemically activated glassy carbon; Void space

Indexed keywords

ACTIVATION ENERGY; CARBON; COPPER; ELECTROCHEMICAL ELECTRODES; ELECTROCHEMISTRY; LEAD; POLARIZATION;

COPPER AND LEAD SPECIES; ELECTROCHEMICALLY ACTIVATED GLASSY CARBON; HYDROPHOBIC INTERACTIONS; VOID SPACE;

ADSORPTION;

EID: 33244491000     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2005.07.044     Document Type: Article

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