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Volumn 127, Issue 1, 2006, Pages 194-199

Investigation on silicon-glass electrostatic bonding time

Author keywords

Anodic bonding; Bonding strength; Critical time; Measuring method

Indexed keywords

ANODIC BONDING; BONDING STRENGTH; CRITICAL TIME; MEASURING METHOD;

EID: 32844471846     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2005.11.054     Document Type: Article
Times cited : (8)

References (11)
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    • G.-S. Chung, and J.-M. Kim Anodic bonding characteristics of MLCA/Si-wafer using a sputtered Pyrex #7740 glass layer for MEMS applications Sens. Actuat. A116 2004 352 356
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    • Electrode phenomena during anodic bonding of silicon to sodium borosilicate glass
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.