-
1
-
-
0014563672
-
Field assisted glass-metal sealing
-
G. wallis, and D.I. Pomerantz Field assisted glass-metal sealing J. Appl. Phys. 40 10 1969 3946 3949
-
(1969)
J. Appl. Phys.
, vol.40
, Issue.10
, pp. 3946-3949
-
-
Wallis, G.1
Pomerantz, D.I.2
-
2
-
-
0032136370
-
Wafer-to-wafer bonding for microstructure formation
-
M.A. Schmidt Wafer-to-wafer bonding for microstructure formation Proc. IEEE 86 8 1998 1574
-
(1998)
Proc. IEEE
, vol.86
, Issue.8
, pp. 1574
-
-
Schmidt, M.A.1
-
3
-
-
0035280357
-
Glass-to-glass electrstatic bonding with intermediate amorphous silicon film for vacuum packaging of microelectronics and its application
-
D.-J. Lee Glass-to-glass electrstatic bonding with intermediate amorphous silicon film for vacuum packaging of microelectronics and its application Sens. Actuat. A 89 2001 43 48
-
(2001)
Sens. Actuat. A
, vol.89
, pp. 43-48
-
-
Lee, D.-J.1
-
4
-
-
4544261833
-
Anodic bonding characteristics of MLCA/Si-wafer using a sputtered Pyrex #7740 glass layer for MEMS applications
-
G.-S. Chung, and J.-M. Kim Anodic bonding characteristics of MLCA/Si-wafer using a sputtered Pyrex #7740 glass layer for MEMS applications Sens. Actuat. A116 2004 352 356
-
(2004)
Sens. Actuat.
, vol.116
, pp. 352-356
-
-
Chung, G.-S.1
Kim, J.-M.2
-
5
-
-
0026836993
-
A computer aided design system for microelectromechanical systems
-
S.D. Senturia, B.P. Johson, and S. Kim A computer aided design system for microelectromechanical systems J. Microelectromech. S. 1 1 1992 3 13
-
(1992)
J. Microelectromech. S.
, vol.1
, Issue.1
, pp. 3-13
-
-
Senturia, S.D.1
Johson, B.P.2
Kim, S.3
-
6
-
-
4344622276
-
Influence of bonding parameters on electrostatic force in anodic wafer bonding
-
G.Y. Li, and L. Wang Influence of bonding parameters on electrostatic force in anodic wafer bonding Thin Solid Films 462-463 2004 334 338
-
(2004)
Thin Solid Films
, vol.462-463
, pp. 334-338
-
-
Li, G.Y.1
Wang, L.2
-
9
-
-
0026238980
-
Electrode phenomena during anodic bonding of silicon to sodium borosilicate glass
-
K.B. Albaugh Electrode phenomena during anodic bonding of silicon to sodium borosilicate glass J. Electrochem. Soc. 138 10 1991 3089 3094
-
(1991)
J. Electrochem. Soc.
, vol.138
, Issue.10
, pp. 3089-3094
-
-
Albaugh, K.B.1
-
10
-
-
32844458490
-
Spreading model of silicon-glass bonding with point cathode
-
Shanghai, China, October
-
X. Liu, et al., Spreading model of silicon-glass bonding with point cathode, in: Proceedings of the 4th International Workshop on Microfactories, vol. 1, Shanghai, China, October 2004, pp. 205-210.
-
(2004)
Proceedings of the 4th International Workshop on Microfactories
, vol.1
, pp. 205-210
-
-
Liu, X.1
-
11
-
-
0020750966
-
Anodic bonding of imperfect surfaces
-
R. Thomas, and Anthony Anodic bonding of imperfect surfaces J. Appl. Phys. 54 5 1983 2419 2428
-
(1983)
J. Appl. Phys.
, vol.54
, Issue.5
, pp. 2419-2428
-
-
Thomas, R.1
Anthony2
|