Impact of cubic pin finned surface structure geometry upon spray cooling heat transfer

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART A, Issue , 2005, Pages 1-10

  Silk, Eric A ^a   Kim, Jungho ^b   Kiger, Ken ^b  

^a NASA GODDARD SPACE FLIGHT CENTER   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

Dissolved Gas; Enhancement; Finned Surfaces; Heat Transfer; Spray Cooling

Indexed keywords

ELECTRONICS PACKAGING; HEAT FLUX; PARAMETER ESTIMATION; SEPARATION; SURFACES;

DISSOLVED GAS; ENHANCEMENT; FINNED SURFACES; SPRAY COOLING;

HEAT TRANSFER;

EID: 32844465922     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73003     Document Type: Conference Paper

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