The sintering process of Ag metallo-organic nanoparticles and the influence of the joining parameters upon Cu-to-Cu joining

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART B, Issue , 2005, Pages 887-892

  Angata, Shinji ^a   Ide, Eiichi ^a   Hirose, Akio ^a   Kojiro, Kobayashi F ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AGGLOMERATION; BONDING; COPPER; NANOSTRUCTURED MATERIALS; SINTERING;

AG METALLO-ORGANIC NANOPARTICLES; JOINT STRENGTHS;

SILVER;

EID: 32844460193     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73164     Document Type: Conference Paper

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5. H.Nagasawa, M.Maruyama, T.Komatsu, S.Isoda and T.Kobayashi, 2002, Phys. Stat. Sol., 191, pp.67.
6. Eiichi Ide, Shinji Angata, Akio Hirose and Kobayashi F. Kojiro, 2005 (In Press), Acta Materialia.