Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates

Journal of Electronic Materials

Volumn 35, Issue 1, 2006, Pages 165-169

  Wang, S S ^a   Tseng, Y H ^b   Chuang, T H ^c  

^a DE LIN INSTITUTE OF TECHNOLOGY   (Taiwan)

^b Vishay   (United States)

^c NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Growth kinetics; In 49Sn Ni; Soldering reaction; Ternary Ni33In20Sn 47 intermetallics

Indexed keywords

DIFFUSION-CONTROLLED MECHANISM; IN-49SN/NI; SOLDERING REACTION; TERNARY NI33IN20SN 47 INTERMETALLICS;

ACTIVATION ENERGY; INDIUM ALLOYS; INTERFACES (MATERIALS); NICKEL; SOLDERING ALLOYS; X RAY DIFFRACTION;

INTERMETALLICS;

EID: 32644438301     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0199-5     Document Type: Conference Paper

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