An overview of electrical characterization techniques and theory for IC packages and interconnects

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 1, 2006, Pages 131-139

  McGibney, Eoin ^a   Barrett, John ^a  

^a Department of Chemistry   (Ireland)

Author keywords

Electrical characterization; Equivalent circuit modeling; Frequency domain; Measurements; Time domain

Indexed keywords

EQUIVALENT CIRCUITS; FREQUENCY DOMAIN ANALYSIS; INTEGRATED CIRCUIT MANUFACTURE; INTERCONNECTION NETWORKS; MEASUREMENTS; NUMERICAL METHODS; SEMICONDUCTOR DEVICE MODELS; TIME DOMAIN ANALYSIS;

ELECTRICAL CHARACTERIZATION; ELECTROMAGNETIC MODELING; EQUIVALENT CIRCUIT MODELING;

CHIP SCALE PACKAGES;

EID: 32444451189     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.849550     Document Type: Review

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