Formulating a cycloaliphatic epoxy for microelectronic encapsulation: A DSC study on a model system

American Chemical Society, Polymer Preprints, Division of Polymer Chemistry

Volumn 37, Issue 1, 1996, Pages 186-187

  Buchwalter, Stephen L ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACETAL RESINS; AMINES; AROMATIC POLYMERS; CHEMICAL RESISTANCE; CURING; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONICS PACKAGING; ENCAPSULATION; ESTERIFICATION; HYDROLYSIS; MICROELECTRONIC PROCESSING; POLYETHYLENE GLYCOLS;

CYCLOALIPHATIC EPOXY RESINS; TRANSETHERIFICATION;

EPOXY RESINS;

EID: 3242872342     PISSN: 00323934     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (10)

1. L. T. Manzione, Plastic Packaging of Microelectronic Devices, Van Nostrand Reinhold, New York, 1990.
2. D. Suryanarayana, R. Hsiao, T. P. Gall, J. M. McCreary, IEEE Trans. Comp. Hybrids Manuf. Technol., 1991, 14, 218-223.
3. D. W. Wang, K. I. Papathomas, IEEE Trans. Comp. Hybrids Manuf. Technol., 1993, 16, 863-7
4. a) S. L. Buchwalter, L. L. Kosbar, J. D. Gelorme, Symposium on Polymers for Microelectronics, PMSE, ACS National Meeting, Anaheim, CA, April 1995
5. b) S.L. Buchwalter, A. Call, J. Coffin, F. Pompeo, 1st International Symposium on Packaging Materials, Processes and Interfaces, ISHM, Atlanta, GA, February, 1995
6. c) S. L. Buchwalter, L. L. Kosbar, J. Polym. Sci. Polym. Chem. Ed., in press.
7. S. L. Buchwalter, L. L. Kosbar, J. D. Gelorme, A. Afzali-Ardakani, F. L. Pompeo, B. Newman, U.S. patent pending.
8. H. Batzer, Chem. Ind., 1964, 179-89
9. J. J. Stevens, Epoxy Resin Technology, Interscience Publishers, 1968, 11-30.
10. Cycloaliphatic Epoxide Systems, report issued by Union Carbide Chemicals & Plastics Technology Corporation, 1989.