Foamed aromatic copolyester films for multichip module laminates

American Chemical Society, Polymer Preprints, Division of Polymer Chemistry

Volumn 37, Issue 1, 1996, Pages 160-161

  Schneggenburger, L A ^a   Economy, J E ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE FILMS; CROSSLINKING; DIMENSIONAL STABILITY; ELECTRONICS PACKAGING; FOAMED PLASTICS; LIQUID CRYSTAL POLYMERS; MULTICHIP MODULES; PLASTIC LAMINATES; THERMAL EXPANSION;

AROMATIC COPOLYESTER FILMS; COEFFICIENT OF THERMAL EXPANSION;

AROMATIC POLYMERS;

EID: 3242862953     PISSN: 00323934     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (8)

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