Active ester-cured epoxy resins for electronic packaging

American Chemical Society, Polymer Preprints, Division of Polymer Chemistry

Volumn 37, Issue 1, 1996, Pages 188-189

  Nakamura, Shigeo ^a   Nishikubo, Tadatomi ^a  

^a KANAGAWA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; CATALYSTS; CURING; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; ESTERS; GLASS TRANSITION; PERMITTIVITY; THERMAL EXPANSION; THERMODYNAMIC STABILITY; VISCOELASTICITY; WATER ABSORPTION;

ACTIVE ESTER CURED EPOXY RESINS; HYGROSCOPIC PROPERTIES;

EPOXY RESINS;

EID: 3242830124     PISSN: 00323934     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

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