Thermal-induced interfacial cracking of magnetoelectroelastic materials

International Journal of Engineering Science

Volumn 42, Issue 13-14, 2004, Pages 1347-1360

  Gao, Cun Fa ^a   Noda, Naotake ^a  

^a SHIZUOKA UNIVERSITY   (Japan)

Author keywords

Interface crack; Magnetoelectroelastic solid; Stress intensity factor; Thermal loading

Indexed keywords

CRACKING (CHEMICAL); ELECTRIC FIELDS; MAGNETIC FIELDS; MAGNETOELECTRIC EFFECTS; OSCILLATORS (ELECTRONIC); PIEZOELECTRIC DEVICES; POTENTIAL FLOW; STRESS ANALYSIS; STRESS INTENSITY FACTORS; SURFACE CHEMISTRY;

ELASTIC BI-MATERIAL SYSTEMS; INTERFACE CRACKS; MAGNETOELECTROELASTIC SOLID; THERMAL LOADING;

MAGNETIC MATERIALS;

EID: 3242738285     PISSN: 00207225     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijengsci.2004.03.005     Document Type: Article

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