Mechanical characterization and design of flexible silicon microstructures

Journal of Microelectromechanical Systems

Volumn 13, Issue 3, 2004, Pages 452-464

  Lisby, Torben ^a   Nikles, Stefan A ^b   Najafi, Khalil ^b   Hansen, Ole ^c   Bouwstra, Siebe ^d   Branebjerg, Jens A ^a  

^a DELTA Danish Electronics Light & Acoustics   (Denmark)

^b UNIVERSITY OF MICHIGAN   (United States)

^c TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^d European Headquarter and Development Center   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FLAT CABLES; FRACTURE TESTING; MATHEMATICAL MODELS; MULTICHIP MODULES; OPTIMIZATION; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICE STRUCTURES; SEMICONDUCTOR DEVICE TESTING; SEMICONDUCTOR DOPING;

BENDING FRACTURE STRAIN; MICROFLEX INTERCONNECTS; MULTICHIP PACKAGING STRUCTURES; SILICON MICROSTRUCTURES; SILICON RIBBON CABLES;

SEMICONDUCTING SILICON;

EID: 3242730310     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2004.828744     Document Type: Article

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