A 2xxx aluminum alloy crept at medium temperature: Role of thermal activation on dislocation mechanisms

Materials Science and Engineering: A

Volumn 380, Issue 1-2, 2004, Pages 110-116

  Majimel, J ^a   Casanove, M J ^a   Molenat G ^a  

^a CEMES CNRS   (France)

Author keywords

Al(CuMg) aluminum alloy; Creep behavior; Dislocation mechanisms; Non close packed glide; Thermal activation

Indexed keywords

CREEP TESTING; MICROSTRUCTURE; STRAIN RATE; THERMOANALYSIS; TRANSMISSION ELECTRON MICROSCOPY;

PRECIPITATE DENSITY; THERMAL ACTIVATION;

ALUMINUM ALLOYS;

ALUMINUM; CREEP; TEMPERATURE EFFECT;

EID: 3242714810     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2004.03.050     Document Type: Article

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