Effects on seal material resulting from a pre-assembly temperature difference between the TFT and CF substrate

Digest of Technical Papers - SID International Symposium

Volumn 36, Issue 1, 2005, Pages 76-79

  Hoysan, S F ^a   Kuroki, H ^a  

^a Corning Incorporated ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PRE-ASSEMBLY TEMPERATURE; SEAL LAYOUT; SEAL MATERIAL; TEMPERATURE DIFFERENCE;

ARRAYS; ELECTRIC BATTERIES; FINITE ELEMENT METHOD; TEMPERATURE DISTRIBUTION;

SEALS;

EID: 32144448907     PISSN: 0097966X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1889/1.2036558     Document Type: Conference Paper

References (3)

1. Unpublished work, ANSYS Inc., Canonsburg, PA.
2. W.R. Powell et al, Computer Simulation of LCD Sheet Distortion Associated with Gravity Mura Defect, SID Digest, 2004
3. Corning code 1737 glass material information sheet, www.corning.com