Thermal imaging bundle

IEEE Circuits and Devices Magazine

Volumn 21, Issue 6, 2005, Pages 28-33

  Gannot, Israel ^a,b  

^a TEL AVIV UNIVERSITY   (Israel)

^b GEORGE WASHINGTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BIOCOMPATIBILITY; CAMERAS; INFRARED SPECTROSCOPY; MEDICAL APPLICATIONS; MEDICINE; THERMOGRAPHY (IMAGING);

INFRARED IMAGING FIBER BUNDLES; THERMAL IMAGING BUNDLE; VISIBLE RANGE;

INFRARED IMAGING;

EID: 31944435219     PISSN: 87553996     EISSN: None     Source Type: Journal    
DOI: 10.1109/MCD.2005.1578585     Document Type: Article

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