Key factors of the peel ply surface preparation process

International SAMPE Symposium and Exhibition (Proceedings)

Volumn 50, Issue , 2005, Pages 1959-1967

  Klapprott, David ^a   Li, Helen ^a   Wong, Raymond ^a   Geisendorfer, George ^a  

^a HENKEL CORPORATION   (United States)

Author keywords

Adhesive Bonding; Adhesives; Resins Materials Epoxy; Surface Preparation Materials Processes

Indexed keywords

ADHESIVES; BONDING; COMPOSITE STRUCTURES; EPOXY RESINS; NYLON POLYMERS; POLYESTERS; SURFACE PROPERTIES;

ADHESIVE BONDING; RESIN/MATERIALS-EPOXY; SURFACE PREPARATION MATERIALS/PROCESSES;

PEELING;

EID: 31944431664     PISSN: 08910138     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. st International SAMPE Symposium, March 24-28, 1996, pp. 303-317