Direct wafer bonding & thinning down a generic technology to perform new structures

Proceedings - Electrochemical Society

Volumn PV 2005-02, Issue , 2005, Pages 64-77

  Aspar, B ^a   Lagahe Blanchard, C ^a   Moriceau, H ^b  

^a TRACIT Technologies   (France)

^b CEA LETI   (France)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS;

GENERIC TECHNOLOGY; MICROSYSTEMS; WAFER BONDING;

SILICON WAFERS;

EID: 31844451525     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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