Study of novel electronic packaging material 70%Si-Al prepared by the spray deposition

Jinshu Xuebao/Acta Metallurgica Sinica

Volumn 41, Issue 12, 2005, Pages 1277-1279

  Wang, Xiaofeng ^a   Zhao, Jiuzhou ^a   Tian, Chong ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

70 Si Al alloy; Electronics package material; Hot isostatic pressing (HIP); Spray deposition; Thermal expansion

Indexed keywords

EID: 31844449941     PISSN: 04121961     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (13)