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Volumn 5941, Issue , 2005, Pages 1-8

Stress analysis of transferred thin-GaN LED by Au-Si wafer bonding

Author keywords

Au Si alloy; Laser lift off; Raman spectroscopy; Stress analysis; Thin GaN; Wafer bonding

Indexed keywords

GALLIUM NITRIDE; HEAT LOSSES; LIGHTING; RAMAN SPECTROSCOPY; SAPPHIRE; SILICON WAFERS; STRESS ANALYSIS; THERMAL CONDUCTIVITY;

EID: 31844446275     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.615677     Document Type: Conference Paper
Times cited : (3)

References (17)
  • 8
    • 31844449589 scopus 로고    scopus 로고
    • Alloy Phase Diagrams
    • Hugh Baker, etc., "ASM Handbook", Volume 3, Alloy Phase Diagrams.
    • ASM Handbook , vol.3
    • Baker, H.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.