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Volumn 5941, Issue , 2005, Pages 1-8
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Stress analysis of transferred thin-GaN LED by Au-Si wafer bonding
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Author keywords
Au Si alloy; Laser lift off; Raman spectroscopy; Stress analysis; Thin GaN; Wafer bonding
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Indexed keywords
GALLIUM NITRIDE;
HEAT LOSSES;
LIGHTING;
RAMAN SPECTROSCOPY;
SAPPHIRE;
SILICON WAFERS;
STRESS ANALYSIS;
THERMAL CONDUCTIVITY;
AU-SI ALLOY;
LASER LIFT-OFF;
THIN-GAN;
WAFER BONDING;
LIGHT EMITTING DIODES;
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EID: 31844446275
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1117/12.615677 Document Type: Conference Paper |
Times cited : (3)
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References (17)
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