Through-thickness properties of 2D woven SiC/SiC panels with various microstructures

Ceramic Engineering and Science Proceedings

Volumn 25, Issue 4, 2004, Pages 71-78

  Yun, H M ^a   DiCarlo, J A ^a  

^a NASA GLENN RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE PANELS; CRACKING STRENGTH; SPACE PROPULSION SYSTEMS;

CRACK INITIATION; CREEP; SILICON CARBIDE; STRAIN; TENSILE STRENGTH;

STRUCTURAL PANELS;

EID: 31844444724     PISSN: 01966219     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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11. nd ed. 1977.