MMIC compatible lateral deflection RF MEMS switches

Proceedings - Electrochemical Society

Volumn PV 2005-04, Issue , 2005, Pages 301-310

  Chang Chien, Patty P ^a  

^a NORTHROP GRUMMAN CORPORATION   (United States)

Author keywords

DC Contact Switch; Hermetic Packaging; Lateral Deflection; MEMS; MEMS Switch; Micromachined MEMS Switch; RF MEMS; Wafer Level Packaging

Indexed keywords

DC CONTACT SWITCH; HERMETIC PACKAGING; LATERAL DEFLECTION; MEMS SWITCH; RF MEMS;

OPTICAL SWITCHES; RELIABILITY; SILICON WAFERS;

MICROELECTROMECHANICAL DEVICES;

EID: 31844432095     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. A. Kong, R. Stokes, J. Trieu, R. Bhorania, and M. Lammert. "Planar Airbridge RF Terminal MEMS Switch", U.S. Patent 6,218,911 B1, 2001.
2. R. B. Stokes, A. M. Kong, J.P. Trieu, and R. U. Bhorania, "Lateral Deflection RF MEMS Switch", Government Microcircuit Application Conference (GOMAC), Apr. 2003, paper 16-6.
3. P. Chang-Chien, R. Stokes, R. Bhorania, J. Uyeda, M. Truong, K. Padmanabhan, A. Kong, R. Grundbacher, R. Lai, A. Oki, "MMIC Compatible High Performance Lateral Deflection RF MEMS Switches," 2004 International Conference On Compound Semiconductor Manufacturing, (GaAs ManTech), May, 2004. Miami Beach FL. Paper 10b-5.
4. P. Chang-Chien, K. Tomquist, M. Truong, C. Geiger, J. Lee, J. Uyeda, R. Grundbacher, R. Lai and A. Oki, "Low Temperature Wafer-Level Packaging for RF MEMS Switches", Government Microcircuit Application Conference (GOMAC), Apr. 2005, Las Vegas, NV, paper number 6.4.