Thermal decomposition mechanisms of tungsten nitride CVD precursors on Cu(1 1 1)

Surface Science

Volumn 600, Issue 3, 2006, Pages 743-754

  Yang, Yaw Wen ^a,b   Wu, Jin Bao ^b,c   Wang, Jelin ^b,d   Lin, Yi Feng ^b   Chiu, Hsin Tien ^b  

^a NATIONAL SYNCHROTRON RADIATION RESEARCH CENTER   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^c INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^d TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

Chemical vapor deposition; Copper; Surface chemical reaction; Synchrotron radiation photoelectron spectroscopy; Thermal desorption spectroscopy; Tungsten nitrides

Indexed keywords

SURFACE CHEMICAL REACTION; THERMAL DECOMPOSITION SPECTROSCOPY; TUNGSTEN NITRIDES;

CHEMISORPTION; COPPER COMPOUNDS; ENTHALPY; METALLORGANIC CHEMICAL VAPOR DEPOSITION; SYNCHROTRON RADIATION; TUNGSTEN COMPOUNDS; ULTRAHIGH VACUUM; X RAY PHOTOELECTRON SPECTROSCOPY;

PYROLYSIS;

EID: 31644436905     PISSN: 00396028     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.susc.2005.12.004     Document Type: Article

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