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Volumn 82, Issue 1-2, 2004, Pages

Sustainable technologies for the regeneration of acidic tin stripping solutions used in PCB fabrication

Author keywords

Cross flow; Diffusion dialysis; Etch resists; Filtration; HSA electrowinning; Ion exchange membranes; MF; Tin; UF

Indexed keywords

COPPER; ELECTROCHEMICAL ELECTRODES; ELECTROLYTIC ANALYSIS; ELECTROPLATING; ETCHING; FILTRATION; ION EXCHANGE MEMBRANES; NITRIC ACID; PRECIPITATION (CHEMICAL); SOLUTIONS; STRIPPING (REMOVAL); TIN COMPOUNDS;

EID: 3142775748     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: 10.1080/00202967.2004.11871544     Document Type: Article
Times cited : (10)

References (9)
  • 4
    • 1642278113 scopus 로고
    • Printed Circuit Corporation, Report no. 26 Cleaner Tech.
    • Reclamation of Nitric Acid from Solder Strip, Printed Circuit Corporation, 1995, Report no. 26 Cleaner Tech.
    • (1995) Reclamation of Nitric Acid from Solder Strip


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.