Electrical resistivity behavior in Pd-Cu-Ni-P metallic glasses and liquids

Materials Science and Engineering: A

Volumn 375-377, Issue 1-2 SPEC. ISS., 2004, Pages 288-291

  Haruyama, O ^a   Annoshita, N ^a   Nishiyama, N ^c   Kimura, H M ^b   Inoue, A ^b  

^a TOKYO UNIVERSITY OF SCIENCE   (Japan)

^b TOHOKU UNIVERSITY   (Japan)

^c JAPAN SCIENCE AND TECHNOLOGY AGENCY   (Japan)

Author keywords

Bulk glass; Electrical resistivity; Pd Cu Ni P melt; Vitrification

Indexed keywords

COOLING; ELECTRIC CONDUCTIVITY; MELTING; PALLADIUM COMPOUNDS; QUENCHING; VITRIFICATION; COPPER COMPOUNDS; GLASS; LIQUIDS; METALLIC GLASS; NICKEL COMPOUNDS; PHOSPHORUS COMPOUNDS;

LIQUIDUS TEMPERATURE; UNDERCOOLED LIQUIDS; (METALLIC) GLASS; BULK GLASS; ELECTRICAL RESISTIVITY; METALLIC LIQUID; PD-CU-NI-P MELT; RESISTIVITY BEHAVIOR; RESISTIVITY CURVES; UNDERCOOLED LIQUID REGION;

METALLIC GLASS; PALLADIUM COMPOUNDS;

RESISTIVITY;

EID: 3142759389     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2003.10.041     Document Type: Article

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