Deformation behaviors around/at the interface between Zn-electrodeposition and Fe-substrate

ISIJ International

Volumn 44, Issue 5, 2004, Pages 914-918

  Nakai, Kiyomichi ^a   Okamoto, Tadanobu ^a,b   Ohtsubo, Hiroyuki ^a  

^a EHIME UNIVERSITY   (Japan)

^b Narumi China Corporation   (Japan)

Author keywords

Coherency; Electrodeposition; Interface adhesion; Interface structure; Schmid factor; Slip behavior; Twinning; Zn Fe

Indexed keywords

ADHESION; CRYSTALLOGRAPHY; DEFORMATION; DISLOCATIONS (CRYSTALS); ELECTRODEPOSITION; SHEAR STRESS; STRAIN; STRESS CONCENTRATION; TWINNING; X RAY DIFFRACTION ANALYSIS; ZINC;

COHERENCY; INTERFACE ADHESIONS; INTERFACE STRUCTURES; SCHMID FACTORS; SLIP BEHAVIOR; ZN/FE;

INTERFACES (MATERIALS);

EID: 3142750671     PISSN: 09151559     EISSN: None     Source Type: Journal    
DOI: 10.2355/isijinternational.44.914     Document Type: Article

References (6)

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